A method for manufacturing a cast polyurethane elastomer with improved light transmittance of a foam polishing pad and its application as a window material for a foam polishing pad A method for manufacturing a cast polyurethane elastomer, the method includes specific casting and molding process conditions, etc. A casting mixture comprising an isocyanate-terminated polyurethane prepolymer, a diamine-based chain extender, and a fluorocarbon-based compound is formed, and then the casting mixture is allowed to dwell at a specific temperature for a period of time, and finally cured.

　　The polyurethane elastomer material of the foam polishing pad obtained by this method has improved light transmission properties without losing mechanical properties such as hardness and storage modulus; it can be used in processes such as chemical mechanical polishing (CMP) of optical endpoint detection materials, etc.

　　Foam polishing pad conditioning device, chemical mechanical polishing device and method

　　Foam polishing pad conditioning apparatus, chemical mechanical polishing apparatus and method. The apparatus includes a conditioner for conditioning the foam polishing pad; and a data acquisition device for acquiring status data related to the surface status of the foam polishing pad, the conditioner performing the polishing on the polishing pad according to the status data. trim.

　　According to the foam polishing pad trimming device, chemical mechanical polishing device and method of the present technology, by monitoring the state of the surface of the foam polishing pad, the frequency of trimming the surface of the foam polishing pad is controlled according to the state of the polishing pad surface, so that the foam polishing pad can be repaired in time. Trim.

　　It effectively reduces the accumulation of the glaze layer of the foam polishing pad during the chemical mechanical polishing process, so that the removal amount or thickness of the wafer remains stable; the replacement frequency of the foam polishing pad is reduced, and the cost and labor in the chemical mechanical polishing process are reduced. Increased machine productivity.