The geometry and surface of foam polishing pads are optimized for high removal rate and excellent surface finish, and are used in various precision foam polishing pad processes: pre-polishing, fine polishing, ultra-fine polishing, ultra-finishing, chemical mechanical polishing.

　　Foam polishing pads are used in advanced materials including specialty substrates, semiconductor wafers, glass, ceramics, specialty metals and plastics. All CMP pads feature stringent manufacturing process controls and are perfectly suited for semiconductor applications.

　　Foam polishing pad specific application areas include: Wafer CMP Silicone, Semiconductor Global CMP III-V Compounds, Silicon Nitride Global CMP, Oxides and Layer Polymers, Fragile Infrared Materials Substrates Global CMP Polishing, global chemical mechanical polishing of sapphire on gallium nitride and silicon carbide substrates, reconstruction of epitaxial ready substrates, shrinkage of the ends of SOS and SOI wafers to below 20 microns, reverse engineering delay devices for chemical mechanical polishing solution applications.