Multi-structure chemical mechanical foam polishing pad, method of manufacture and application thereof

　　Multi-structure chemical-mechanical foam polishing pad, method of manufacture, and use thereof, comprising: a primary structure, a surface-modified secondary structure, a protective structure, and bonding the primary structure to the surface-modified secondary structure the upper connector, and the lower connector that bonds the surface-modified secondary structure and the protective structure together.

　　The surface-modified secondary structure of this technology has excellent mechanical properties such as elongation at break, tensile strength, etc., its thickness is also more uniform, and the bonding and peeling strength with the connecting body is more excellent, so that the surface The combined performance of chemical mechanical foam polishing pads made from the modified secondary structure was better.

　　A foam polishing pad includes a polishing layer, the polishing layer includes a polishing surface and a polishing unit located on the polishing surface, the polishing unit is at least one, the polishing unit forms a polishing unit group, and one end of the polishing unit group forms a contact surface, and the contact surface In direct contact with the material to be ground, each polishing unit is projected as a parallelogram on the contact surface;

　　When the structure of the foam polishing pad is combined with the defined polishing unit area ratio, effective area ratio, effective channel volume ratio and effective channel width ratio, etc., it has excellent comprehensive performance.