Foam polishing pad, method for manufacturing the same, and method for manufacturing a semiconductor device using the same.

　　Foam polishing pads, methods of making the same, and methods of making semiconductor devices using the same. According to the polishing pad of the present technology, by adjusting the average value of the moduli of the porosity region and the non-porosity region to 0.5 GPa to 1.6 GPa, excellent lifetime characteristics of the foam polishing pad can be achieved, and the appearance on the surface of the semiconductor substrate can be improved. scratches and surface defects, and can further increase the polishing rate.

　　A method and device for converting the initial state of a foam polishing pad to hydrophilic

　　A method and device for converting an initial state of a foam polishing pad to hydrophilic; the method may include: after pasting a new foam polishing pad to a lower plate of a polishing machine, converting a material made of a material that conforms to the set hardness and roughness The wafer is placed in the assembled suction pad of the polishing head.

　　Use the new foam polishing pad to polish the conversion wafers; when the new polishing pad finishes polishing the set number of conversion wafers, the surface state of the new polishing pad changes to hydrophilic sexual status.